Lion Precision - PRODUCT NEWS

New Multichannel Eddy-Current Displacement Sensor offers Lower-Cost, Space-Saving Design

To support designers requiring multichannel displacement sensing in a compact package, Lion Precision has released the ECL150 Eddy-Current Displacement Sensor. The new sensor features up to eight channels of high-resolution, noncontact displacement sensing in a package measuring only 4.2x7.6x2.3 inches (108x193x57 mm).

The ECL150 is built on the company’s new CompactFLEX platform which allows for easy customization for OEM applications.

According to Don Martin, company president, “More and more applications are requiring multiple sensing channels and offering less space to put it in; we needed to provide a better solution to our customers. We’ve reduced the power, cost and space demands while eliminating the need for interconnecting cables between channels.”

The ECL150 is a high-performance noncontact sensing system offering resolutions as low as 2.6 nanometers at 15 kHz bandwidth, and offering measurement ranges from 0.5 to 15 mm.

Typical Resolution:
0.006% RMS
±0.2% of Range
Maximum Bandwidth
15 kHz
 Analog Output
±5 VDC
 Input Power
  12 to 24 VDC, 0.75 W/Channel

More information is available at the Lion Precision Eddy-Current Sensors website: or the company’s primary website:

In 1958, Lion Precision was the first company to provide capacitive displacement sensors to industry. The company has expanded its product offering to include eddy-current displacement sensors and some application specific sensors for the packaging and PCB industries. The company is focused on assisting users in sensor implementation by providing expert guidance and optimized systems including custom designs.

Lion Precision, an IBS Precision Engineering partner, sells the Triskelion in the United States. The company was established in 1958 and pioneered commercially available noncontact sensing systems. The company provides high-performance capacitive and eddy-current displacement sensors for industries such as machine tool, semiconductor, disk drive, automotive, packaging, and university and national laboratory research.

April 2012

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